Difference between mechanical alloying and mechanical disordering in the amorphization reaction of Al50Ta50 in a rod mill

Amorphous Al₅₀Ta₆₀ alloy powders have been synthesized by mechanical alloying (MA) from elemental powders of aluminium and tantalum, and mechanical disordering (MD) from crystalline intermetallic compound powders of AlTa respectively using the rod milling technique. The mechanically alloyed and the mechanically disordered alloy powders were characterized by X-ray diffraction, scanning electron microscopy, electron probe microanalysis, transmission electron microscopy, differential thermal analysis, differential scanning calorimetry and chemical analysis. The results have shown that the crystal-to amorphous transformation in the MD process occurs through one stage, while the crystallineto-amorphous formation in the MA process occurs through three stages. At the early and intermediate stages of the MA time, heating the alloy powders to 700 K leads to the formation of an amorphous phase by a solid-state amorphizing reaction. At the final stage of the MA time, the amorphous phase is crystallized through a single sharp exothermic peak. Contrary to this, amorphous alloy powders produced by MD are crystallized through two broad exothermic peaks.     

Mechanical strengthening of Si cantilever by chemical KOH etching and its surface analysis by TEM and AFM

Mechanical strengthening of a Si cantilever by applying KOH wet etching was investigated. Two kinds of Si cantilever specimens having the different crystallographic orientations of the sidewall surfaces, i.e., Si{100} and Si{110}, were fabricated from the same SOI wafer by a Bosch process. The typical height and pitch of the scalloping formed on the sidewall were 248 and 917 nm, respectively. A 50 % KOH (40 °C) chemical wet etching was applied to increase the fracture stress of the Si cantilever. The fracture stress in the both of Si{100} and Si{110} cantilevers increased with the advance of the etching. The obtained maximum fracture stress in Si{100} and Si{110} were 4.2 and 3.7 GPa, respectively. Sidewall surface of the cantilever was analyzed to investigate the mechanical strengthening of Si cantilever by wet etching. The etched surface crystalline was analyzed by the transmission electron microscope (TEM), and confirmed that the thickness of the affected flow layer was less than 10 nm from the obtained TEM image. Then the change of the surface roughness by the KOH etching was analyzed by the atomic force microscope. The surface was smoothened with the advance of the KOH etching. The roughness value of Ra in Si{100} and Si{110} decreased to 12.1 and 37.7 nm, respectively.     

A new optical elasticity resin for mobile LCD modules

Abstract— The display used in current cell phones has an air gap between the cover glass and the liquid‐crystal‐display (LCD) module to prevent the LCD glass from being damaged. Reflections at the boundaries of the air gap cause a reduction in the LCD luminance and contrast. To address this problem, a newly proposed LCD structure has been investigated. The “Super View Resin (SVR),” a transparent elastic resin which improves the shock resistance and visibility of the LCD, has been developed. Filling the air gap between the cover glass and LCD module with a refractive‐index‐matching resin solves the light‐reflection problem inherent in the use of a reinforced cover‐glass lens. Moreover, the elastic filler works as a damper, reducing any external shock, which prevents not only the cover glass and LCD module from being damaged, but also the glass from being shattered when it is broken.     

Optimizing two-pass connected-component labeling algorithms

We present two optimization strategies to improve connected-component labeling algorithms. Taking together, they form an efficient two-pass labeling algorithm that is fast and theoretically optimal. The first optimization strategy reduces the number of neighboring pixels accessed through the use of a decision tree, and the second one streamlines the union-find algorithms used to track equivalent labels. We show that the first strategy reduces the average number of neighbors accessed by a factor of about 2. We prove our streamlined union-find algorithms have the same theoretical optimality as the more sophisticated ones in literature. This result generalizes an earlier one on using union-find in labeling algorithms by Fiorio and Gustedt (Theor Comput Sci 154(2):165–181, 1996). In tests, the new union-find algorithms improve a labeling algorithm by a factor of 4 or more. Through analyses and experiments, we demonstrate that our new two-pass labeling algorithm scales linearly with the number of pixels in the image, which is optimal in computational complexity theory. Furthermore, the new labeling algorithm outperforms the published labeling algorithms irrespective of test platforms. In comparing with the fastest known labeling algorithm for two-dimensional (2D) binary images called contour tracing algorithm, our new labeling algorithm is up to ten times faster than the contour tracing program distributed by the original authors.

Magnetic order and evolution of the electronic state aroundx=0.12 in La2?xBaxCuO4 and La2?xSrxCuO4

Muon spin rotation ( ⁺SR) measurement provides clear evidence of the antiferromagnetic order of Cu moments below 35 K for La_2–x Ba _x CuO₄ and below 15 K for La_2–x Sr _x CuO₄ in the narrow range ofx where the high-T _c superconductivity (SC) is suppressed remarkably. The results suggest that the change of the electronic state coupled with the lattice instability is relevant to the local suppression of SC and freezing of spin fluctuations of the Cu moment.     

Metal Single-Atom Cocatalyst on Carbon Nitride for the Photocatalytic Hydrogen Evolution Reaction: Effects of Metal Species

Single-atom (SA) catalysts exhibit high activity in various reactions because there are no inactive internal atoms. Accordingly, SA cocatalysts are also an active research fields regarding photocatalytic hydrogen (H₂) evolution which can be generated by abundant water and sunlight. Herein, it is investigated whether 10 transition metal elements can work as an SA on graphitic carbon nitride (g-C₃N₄; i.e., gCN), a promising visible-light-driven photocatalyst. A method is established to prepare SA-loaded gCN at high loadings (weight of ≈3 wt.% for Cu, Ni, Pd, Pt, Rh, and Ru) by modulating the photoreduction power. Regarding Au and Ag, SAs are formed with difficulty without aggregation because of the low binding energy between gCN and the SA. An evaluation of the photocatalytic H₂-evolution activity of the prepared metal SA-loaded gCN reveals that Pd, Pt, and Rh SA-loaded gCN exhibits relatively high H₂-evolution efficiency per SA. Transient absorption spectroscopy and electrochemical measurements reveal the following: i) Pd SA-loaded gCN exhibits a particularly suitable electronic structure for proton adsorption and ii) therefore they exhibit the highest H₂-evolution efficiency per SA than other metal SA-loaded gCN. Finally, the 8.6 times higher H₂-evolution rate per active site of Pd SA is achieved than that of Pd-nanoparticles cocatalyst.     

Gap symmetry and intrinsic intraplane pinning of untwinned YBa2Cu3O7 single crystals

The interplane (cb) and intraplane (ab) anisotropy of untwinned YBa₂ Cu₃0₇ single crystals has been investigated by means of the torque magnetometry. To extract the reversible and irreversible components, the torque was measured as a function of increasing angle as well as decreasing angle. The interplane irreversible torque _irr shows two-fold peaks at _c =90 ° and270 ° (of half width11 ° at77 K) due to the well-known intrinsic interplane pinning. A novel intrinsic pinning has been discovered in the intraplane irreversible torque, i.e., _irr shows four-fold peaks of half width20° at77 K when _a =0 °, 90 °, 180 ° and270 °. We argue that the intrinsic intraplane pinning comes from the four-fold nature of the gap parameter.     

Fabrication of X-rays mask with carbon membrane for diffraction gratings

We have produced diffraction gratings for obtaining high resolution X-ray phase imaging, such as X-ray Talbot interferometer. These diffraction gratings were required to have a fine, high accuracy, high aspect ratio structure. Therefore, we decided to use the X-rays lithography technique that used synchrotron radiation of the directivity for a manufacture process. The accuracy of the completed structure depends largely on the accuracy of the X-ray mask. In our group, a resin material is conventionally used for the membrane of large X-ray masks. However, X-ray masks comprising a resin membrane have the disadvantage that, after several cycles of X-ray exposure, they crease and sag due to X-ray-derived heat. As a substitute for the conventional resin membrane, we experimentally fabricated a new X-ray mask using a carbon wafer membrane. The newly fabricated X-ray mask was subjected to X-ray exposure experiment. We succeeded in making the structure body which was almost shape. And the experimental results verified that the new mask did not deteriorate even when used repeatedly, demonstrating that it was highly durable.     

Fabrication of high hardness Ni mold with electroless nickel–boron thin layer

The nickel electroforming method using a high-concentration nickel sulfamate bath is commonly used to fabricate micro metal molds in the LIGA process; however, this method does not produce micro metal molds of sufficient hardness. One means of improving the hardness of micro metal molds made using the nickel electroforming method is to include additives in the nickel plating solution. Another method is nickel alloy plating or a similar technique. In this research, we used a nickel–boron (Ni–B) electroless alloy plating method to obtain a hard nickel plated film having hardness of 832 Hv. It was also ascertained that Ni–B electroless alloy plated film retains its high hardness even during heat treatment in conditions of 250°C for 1 h. To deal with the high stresses developed in high-hardness plated films, we proposed double-layer nickel electroforming. This method is covered and used on conventional nickel electroforming layer by high hardness micro mold. High hardness micro metal mold using double-layer was fabricated by nickel electroforming and Ni–B electroless alloy plating method.